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From November 4th to 6th, 2025, the 2025 Intel WW LOEM Summit, a grand event in the global top - tier AI computing field, grandly kicked off at the Shangri - La Hotel in Bangkok, Thailand. With the core topic of "Deep Integration of AI and Computing Technology", this summit gathered leading enterprises and technical elites in the global IT industry. As Intel's highest - level Titanium - level global partner and a core strategic cooperation partner in the CTE ecosystem, WEIBU Information participated in the exhibition with a flagship product matrix based on the Intel architecture. Its H24/H26 series L³/L³ Pro thin - and - light laptops and multi - form innovative handheld game consoles won high praise from Intel's senior management for their architecture - level technological breakthroughs and scenario - based innovative designs. During the summit, the two sides further finalized three forward - looking cooperation directions, leading the transformation of the AI terminal industry through technological co - creation and consolidating the benchmark status of global strategic cooperation.

The venue of the 2025 Intel LOEM Summit

In this exhibition, WEIBU Information was highly consistent with the core trend of the summit, "AI - empowered full - scenario computing", and intensively presented the cutting - edge product ecosystem jointly created with Intel. Among them, the H24/H26 series L3/L3 Pro thin - and - light laptops defined a new industry benchmark with architecture - level innovation. The products are strictly in line with the technical specifications of Intel's flagship thin - and - light laptops. The L³ series accurately meets the thin - and - light standards of a thickness ≤ 18mm and a weight ≤ 1100g. The L³ Pro series even breaks through physical limits, compressing the body thickness to ≤ 17mm and controlling the weight to ≤ 1000g. Relying on aviation - grade lightweight alloy materials and nano - level precision stacking technology, it achieves a perfect balance between "ultra - thin and light" and "military - grade stability". In terms of core performance, the products are equipped with Intel's new - generation flagship computing platform and deeply integrate WEIBU's self - developed full - link optimization system. Through three core technologies: underlying hardware adaptation and tuning, intelligent dynamic power consumption distribution algorithms, and ultra - quiet heat dissipation module upgrades, it overcomes the industry pain point of the trade - off between battery life and performance in thin - and - light laptops, achieving an optimal balance between long battery life and powerful performance release. Its excellent energy - efficiency ratio, smooth multi - task handling ability, and stable performance under high - load scenarios have made it the most highly - focused benchmark - level technical exhibit at the summit.

A group of Intel senior executives is visiting WEIBU's exhibition booth.

During the summit, the core management team of WEIBU Information held a closed - door strategic meeting with senior executives from Intel's global ecological cooperation and technology research and development departments. Based on the solid foundation of over a decade of in - depth cooperation between the two sides and in light of the development trend of the global AI terminal industry, three forward - looking cooperation directions were finally identified: First, WEIBU will deeply participate in the joint research and development of Intel's next - generation processor terminal solutions, getting involved in the chip architecture definition stage in advance. Through technological co - creation, the product implementation cycle will be shortened, and the commercialization process of cutting - edge technologies will be accelerated. Second, focusing on core tracks such as AI - enabled thin - and - light laptops, AI - powered mini PCs, and AI all - in - one computers, the high - end product matrix based on the Intel architecture will be expanded to strengthen the full - scenario AI terminal layout. Third, jointly create industry - customized solutions. Relying on Intel's AI transformation plan and WEIBU's full - industrial - chain service capabilities, they will assist global customers in accelerating digital transformation and intelligent upgrading. Intel's senior executives emphasized that WEIBU's comprehensive strength in technology adaptation, scenario innovation, and terminal implementation makes it a core pillar - type partner in the Intel ecosystem in terms of "technological co - creation + industrial implementation".

A group of Intel senior executives pose for a photo while holding WEIBU's handheld game consoles.

A responsible person from WEIBU Information said that participating in this event is not only a global showcase of the company's cutting - edge technological achievements but also a deep upgrade of its synergy with the Intel ecosystem. In the future, WEIBU will continue to take technological innovation as the core driving force, deeply implement the results of this strategic meeting, and plans to launch a number of new products based on the jointly - developed Intel architecture into the global market in 2026. By empowering the intelligent upgrade of the global industry with architecture - level innovative products, it will work hand in hand with Intel to build a new global AI terminal industry ecosystem featuring "technological homology, market synchronization, and ecological co - prosperity", and establish a global benchmark in the field of AI terminals.